Electronics

Electronics

Microelectronics, materials and their structuring properties are the key to realizing high-performance components and taking technologies to the next level.

 

Materials and methods

Inorganic-organic hybrid polymers can be structured directly by lithography or can be formulated chemically as negative or positive resist. To further promote the miniaturization of chips, the semiconductor industry develops new (lithographic) structuring methods that require corresponding novel resist materials. These resist materials must be well-suited for forming structures in the nanometer range. They need to be highly sensitive to the applied radiation and their etching properties should be adaptable.

 

R&D priorities

  • Printed electronics
  • Resist development
  • Materials for smart systems
  • Transparent electronics
  • Protective lacquers

     

Sample applications

Directly structurable smart materials can enhance functions of microelectronic components and offer solutions for system-on-chip and system-in-package concepts that strive to integrate different electronic functional elements in mininum space. The Fraunhofer ISC develops piezoelectric materials that can be processed as functional resist, as well as patterning techniques for the production of MEMS and MOEMS.

 

Find further information on the website of Center Smart Materials and Adaptive Systems CeSMA

SUPERSMART project

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Digitalization, “Internet of things”, and “Industry 4.0” demand for ubiquitous sensing and communication elements. Printed electronic components allow one to reduce the cost per function and to process components in High-Throughput production schemes. The goal of SUPERSMART project is the industrialization of high-performance key materials in order to secure the electronic material supply chain.

Read more about Supersmart Project on the project website, on the handout of Supersmart and on the website of CeSMA Center Smart Materials and Adaptive Systems.

Flexible printed electronics

© Joanneum

The Fraunhofer ISC develops novel piezoelectric printing pastes to render flexible polymer films sensitive. FLEX SENSE is a flexible film with a touch-sensitive surface which senses any deformation. Its printed quasi-transparent piezosensors register any change in pressure. This, along with the development of flexible displays, will give rise to totally new input options that will enable a more intuitive control of electronic devices than currently possible by key, switch or swipe functions.